ProductsProcesses

III-V Etching

InP Etching

• InP Ridge/Mesa Etching for Co-Packaged Optics (CPO)
• InP Laser Grating Etching
• InP Pillar Etching

GaN Etching

• GaN Atomic Layer Etching
• GaN Trench Etching

GaAs Etching

Si DRIE

Bosch Process

• High-aspect-ratio (80:1) Deep Etching
• ø30 nm Si Pillar Etching
• ø70 nm Si Hole Etching
• 450 µm Depth Pillar

Non Bosch Process

• Scallop-Free 126 µm Deep Si Etching for TSVs
• Precision Silicon Nanodevice Etching

Aqua Plasma

Reduction of Metal Oxide

• Copper Oxide Reduction for Electronic Components
• Silver Oxide Reduction for LED Packaging

Bonding Pretreatment