![](https://www.samco.co.jp/en/processes/uploads/bc73afb69186c9fd119cdf805972454245e31269.jpg)
Non-bosch process scallop-less DRIE
Nano-level Si DRIE with line & space = 150/50 nm is achieved by the non-bosch process. Samco' unique solution provides precise Si DRIE with an aspect ratio of 5:1. In principle, sidewall scallops can be a problem in the bosch process Si DRIE. However, sidewall scallops do not occur in non-bosch process DRIE.