![](https://www.samco.co.jp/products/process/uploads/450um_depth_etch.jpg)
The RIE-800iPB was used to form a 450 μm deep pillar with a 30 μm square pattern. It is processed from top to bottom without any film peeling.
Photo courtesy of Taiwan university
The RIE-800iPB was used to form a 450 μm deep pillar with a 30 μm square pattern. It is processed from top to bottom without any film peeling.
Photo courtesy of Taiwan university