Anisotropic etching of SiO₂
Anisotropic plasma etching result of SiO₂ by a large-area RIE plasma etching system RIE-300NR. Multiple wafers can be processed in one batch with excellent uniformity.
ProcessesGrating formation of SiO₂
Anisotropic plasma etching result of SiO₂ by a large-area RIE plasma etching system RIE-300NR. Multiple wafers can be processed in one batch with excellent uniformity.