Si DRIE System RIE-800iPBC
High rate and high aspect-ratio etch
Description
The RIE-800iPBC employs the Bosch process for Deep Reactive Ion Etching (DRIE) of silicon, enabling the fabrication of high aspect ratio structures with precise dimensional control. The system delivers high etch rates, smooth sidewalls, minimal tilt, and exceptional selectivity, addressing the critical requirements of MEMS, Advanced Packaging, and Nanotechnology fabrication. As a cassette-loading system, the RIE-800iPBC handles wafers up to 200 mm (8 inches).
Key Features and Benefits
- High etch rates
- High aspect ratio etch
- High selectivity to photoresist (PR) and oxide
- Control of scalloping / Scallop-less non-bosch process
- Smooth sidewalls
- Excellent uniformity with tilt control
- Bias pulsing for notch control at silicon on insulator (SOI) wafers
- Extended process library
Applications
- MEMS (microelectromechanical systems) such as acceleration sensors, gyroscopes, pressure sensors, actuators, and microfluidic devices
- Through Silicon Via (TSV)
- Inkjet printer head
- Power devices (super-junction MOSFETs)
- Plasma Dicing / Scribing
