Liquid Source CVD System PD-330STC
Processing up to ø300 mm (12") with atmospheric cassette loading
Description
The PD-330STC is a low-temperature (80 ~ 400°C), high-rate (>300 nm/min) plasma-enhanced CVD system for mass production. Samco's unique liquid source CVD system uses self-bias deposition techniques and a liquid TEOS source to deposit SiO2 films with low stress, from thin films to extremely thick films (up to 100 µm). This system achieves high throughput by employing atmospheric cassette loading and excellent process uniformity of ø300 mm wafer.
Key Features and Benefits
- Processing up to ø300 mm (12")
- Cathode coupled self-bias deposition techniques enables the high rate (>300 nm/min) deposition of low-stress films
- By low temperatures deposition, films can be deposited on top of plastic surfaces
- Excellent step-coverage of high aspect ratio structures
- Control of refractive index by using germanium, phosphorus, and boron liquid source
- Excellent process uniformity and repeatability
Applications
- Deposition of protective films over plastic materials
- Deposition of the insulating film on via sidewalls for 3D LSIs
- Fabrication of optical waveguides (fiber core/cladding)
- Fabrication of masks for use in the production of micromachines
- Coverage of high aspect ratio structures such as MEMS devices
- Temperature compensation film and passivation film for SAW devices
Papers
- Watanabe, N., Araga, Y., Shimamoto, H., Kikuchi, K., & Nagata, M. (2019, October). Development of Backside Buried Metal Layer Technology for 3D-ICs. In International Symposium on Microelectronics (Vol. 2019, No. 1, pp. 000268-000273). International Microe
- Kusuda, Y. (2012, June). Through Silicon Via (TSV) Process Using DRIE and Cathode Coupled PE-CVD. In Meeting Abstracts (No. 34, pp. 2721-2721). The Electrochemical Society.
