Atomic Layer Deposition (ALD) Systems
Atomic layer deposition (ALD) is a thin-film growth technology that is capable of depositing pinhole-free and uniform insulator films for electronic devices (Power and RF). ALD offers exceptional conformality on the high-aspect-ratio trench and via structures, thickness control at the angstrom level, and tunable film composition based on sequential, self-limiting reactions. Samco provides a highly flexible open-loaded thermal ALD system AL-1 and loadlock plasma-enhanced ALD system AD-230LP.
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Plasma Enhanced ALD System AD-800LP
Excellent repeatability & stability
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Thermal ALD System AL-1
Pin-hole free films deposition
Key Features and Benefits
- Self-limiting layer-by-layer deposition
- Conformal coating on the high-aspect-ratio structures
- Pin-hole and particle free
- Wide range of precursor materials and processes
Schematic of ALD process flow
- AIOx film deposition by using TMA (trimethylaluminum) and H2O / O2 plasma.
- Repeating the cycle from A to D.
- Only one atomic layer remains on the surface of the substrate after purging in step B (self-limiting).
