![](https://www.samco.co.jp/products/process/uploads/20190110SiBoschProcessDRIE400ipb1.jpg)
Bosch Process
A high aspect ratio structure of 3 μm in width and 70 μm in depth was formed by the RIE-400iPB, a deep silicon etching system for research and development. The selection ratio of silicon to resist is about 100:1.
Photo courtesy of Yamagata research institute of technology
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