Anisotropic etching of SiO₂
Anisotropic plasma etching result of SiO₂ by a large-area RIE plasma etching system RIE-300NR. Multiple wafers can be processed in one batch with excellent uniformity.
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ProcessesGrating formation of SiO₂
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Anisotropic plasma etching result of SiO₂ by a large-area RIE plasma etching system RIE-300NR. Multiple wafers can be processed in one batch with excellent uniformity.