-
1979
- Sep.
- Samco International, Inc. was established
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1980
- Jul.
- Released large CVD system for semiconductor process
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1981
- Apr.
- Released Japan’s first MOCVD system
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1984
- Jul.
- Opened Tokyo branch office
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1985
- Jun.
- Moved HQ to current location
- Jun.
- Started selling products of March Instruments Inc. (now NORDSON CORPORATION)
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1987
- Feb.
- Opened OPTO films research laboratory in Sunnyvale
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1990
- Nov.
- Released LSCVD® system for processing of TEOS SiO2 film
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1991
- Mar.
- Opened R&D Center I in Kyoto
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1993
- Feb.
- Opened Tsukuba Office
- Sep.
- Opened Tokai Branch
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1994
- Feb.
- Released ferroelectric film deposition system using technology of Symetrix Corporation
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1995
- Jul.
- Developed the CFC pollution-free technique using thin film technology
- Dec.
- Released compact reactive ion etching system RIE-10NR
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1996
- Dec.
- Released ICP etching system RIE-101iP
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1997
- Nov.
- Developed DLC (diamond-like carbon) film coating technology on plastic bottles in collaboration with Kirin Brewery Co., Ltd.
- Nov.
- Released ICP etching system RIE-200iP
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1998
- Dec.
- Released compact PECVD system PD-220
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1999
- Jul.
- Acquired field support business from Samco Engineering Co., Ltd.
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2000
- Jan.
- Opened Cambridge Research Laboratory at University of Cambridge, UK
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2001
- May
- Became publicly listed in JSDA Over-the-Counter Trading Securities Market
- Jul.
- Opened Taiwan Office
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2002
- Jul.
- Opened Production Center I in Kyoto
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2003
- Nov.
- Released production type PECVD system PD-220LC
- Dec.
- Introduced high speed silicon deep etching technology from Robert Bosch GmbH
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2004
- Nov.
- Opened Shanghai Office
- Dec.
- Changed company name to Samco Inc.
- Dec.
- Withdrew from JSDA Over-the-Counter Trading Securites Market and became publicly listed in JASDAQ Securities Exchange Market
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2005
- May
- Released plasma CVD system PD-2203L (Cluster Lab) for general purpose
- Sep.
- Provided to British business the technology of mass-producing ferroelectric-carbon nanotubes which was developed together with University of Cambridge
- Dec.
- Released compact batch-type plasma cleaning system PC-300 for cleaning electronic substrate
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2006
- Mar.
- Opened Product Service Center
- May
- Released dry etching system RIE-800iPB for MEMS
- Sep.
- Signed a collaborative research agreement with Tsinghua University (China)
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2007
- Nov.
- Released ICP etching system RIE-140iP for LD
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2008
- Mar.
- Opened R&D Center II in Kyoto
- May
- Released production type MOCVD system MCV-2018 for GaN film deposition
- Oct.
- Established a subsidiary, Samco Global Service Inc., in Taiwan for field support
- Nov.
- Released production type ICP etching system RIE-330iPC for LED
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2009
- Jan.
- Started running of Samco Global Service Inc.
- Apr.
- Held 30th anniversary event at Kyoto Hotel Okura
- Oct.
- Released R&D type dry etching system RIE-400iPB for MEMS
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2010
- Apr.
- Became listed in Osaka Securies Exchange JASDAQ Market (now TSE JASDAQ (standard) market) as a result of the merge of Osaka Securities of Exchange, Co., Ltd. and Jasdaq Securities Exchange, Inc.
- Jul.
- Released production type plasma CVD system PD-330STC for TSV
- Jul.
- Released production type plasma CVD system PD-5400 for LED
- Aug.
- Opened East Coast Office in North Carolina, U.S. (Relocated in New York in May 2014)
- Sep.
- Opened Beijing Office
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2011
- Dec.
- Released production type ICP etching system RIE-331iPC for LED
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2012
- Nov.
- Released ICP etching system RIE-600iP for SiC power device
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2013
- Jul.
- Transferred Samco’s stock listing to Tokyo Stock Exchange Market Second Section
- Oct.
- Released production type ICP etching system RIE-600iPC for SiC power device
- Nov.
- Released production type RIE system RIE-800iPBC for MEMS
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2014
- Jan.
- Transferred Samco’s stock listing to Tokyo Stock Exchange Market First Section
- Mar.
- Signed distribution agreement of MOCVD systems with Valence Process Equipment Inc. (U.S.)
- May
- Acquired UCP Processing (Lichtenstein) as a subsidiary (Later renamed as samco-ucp AG)
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2015
- Sep.
- Increased capital to JPY 1.66 billion through public offering
- Dec.
- Signed distribution agreement of SiC epitaxial CVD system with Epiluvac AB (Sweden)
Released ALD system AL-1 for electronic devices
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2016
- Jun.
- Opened Production Center II in Kyoto
- Aug.
- Opened Malaysia Office
- Sep.
- Released Aqua Plasma™ cleaner AQ-2000
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2019
- Sep.
- Held 40th anniversary event at Kyoto Hotel Okura
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2020
- Jul.
- Opened PECVD and ALD demonstration facility in the Production Building II
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2021
- Mar.
- Developed plasma techniques for inactivation of coronaviruses
- Dec.
- Released cluster tool system Cluster H™ for compound semiconductor device
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2022
- Mar.
- Opened research center for nano thin films & materials
- Apr.
- Transferred Samco’s stock listing to Prime Market of the Tokyo Stock Exchange
- Oct.
- Released plasma enhanced ALD system AD-800LP
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2023
- Oct.
- Released three-chamber plasma enhanced CVD system PD-2203LC
- Nov.
- Started research collaboration with Eastern Switzerland University of Applied Sciences (OST)
- Nov.
- Decided to construct third R&D facility for innovative semiconductor process equipment
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2024
- May
- Started to construct third R&D facility, named Advanced Technology Development Center