1. 1979

    Sep.
    Samco International, Inc. was established

  2. 1980

    Jul.
    Released large CVD system for semiconductor process

  3. 1981

    Apr.
    Released Japan’s first MOCVD system

  4. 1984

    Jul.
    Opened Tokyo branch office

  5. 1985

    Jun.
    Moved HQ to current location
    Jun.
    Started selling products of March Instruments Inc. (now NORDSON CORPORATION)

  6. 1987

    Feb.
    Opened OPTO films research laboratory in Sunnyvale

  7. 1990

    Nov.
    Released LSCVD® system for processing of TEOS SiO2 film

  8. 1991

    Mar.
    Opened R&D Center I in Kyoto

  9. 1993

    Feb.
    Opened Tsukuba Office
    Sep.
    Opened Tokai Branch

  10. 1994

    Feb.
    Released ferroelectric film deposition system using technology of Symetrix Corporation

  11. 1995

    Jul.
    Developed the CFC pollution-free technique using thin film technology
    Dec.
    Released compact reactive ion etching system RIE-10NR

  12. 1996

    Dec.
    Released ICP etching system RIE-101iP

  13. 1997

    Nov.
    Developed DLC (diamond-like carbon) film coating technology on plastic bottles in collaboration with Kirin Brewery Co., Ltd.
    Nov.
    Released ICP etching system RIE-200iP

  14. 1998

    Dec.
    Released compact PECVD system PD-220

  15. 1999

    Jul.
    Acquired field support business from Samco Engineering Co., Ltd.

  16. 2000

    Jan.
    Opened Cambridge Research Laboratory at University of Cambridge, UK

  17. 2001

    May
    Became publicly listed in JSDA Over-the-Counter Trading Securities Market
    Jul.
    Opened Taiwan Office

  18. 2002

    Jul.
    Opened Production Center I in Kyoto

  19. 2003

    Nov.
    Released production type PECVD system PD-220LC
    Dec.
    Introduced high speed silicon deep etching technology from Robert Bosch GmbH

  20. 2004

    Nov.
    Opened Shanghai Office
    Dec.
    Changed company name to Samco Inc.
    Dec.
    Withdrew from JSDA Over-the-Counter Trading Securites Market and became publicly listed in JASDAQ Securities Exchange Market

  21. 2005

    May
    Released plasma CVD system PD-2203L (Cluster Lab) for general purpose
    Sep.
    Provided to British business the technology of mass-producing ferroelectric-carbon nanotubes which was developed together with University of Cambridge
    Dec.
    Released compact batch-type plasma cleaning system PC-300 for cleaning electronic substrate

  22. 2006

    Mar.
    Opened Product Service Center
    May
    Released dry etching system RIE-800iPB for MEMS
    Sep.
    Signed a collaborative research agreement with Tsinghua University (China)

  23. 2007

    Nov.
    Released ICP etching system RIE-140iP for LD

  24. 2008

    Mar.
    Opened R&D Center II in Kyoto
    May
    Released production type MOCVD system MCV-2018 for GaN film deposition
    Oct.
    Established a subsidiary, Samco Global Service Inc., in Taiwan for field support
    Nov.
    Released production type ICP etching system RIE-330iPC for LED

  25. 2009

    Jan.
    Started running of Samco Global Service Inc.
    Apr.
    Held 30th anniversary event at Kyoto Hotel Okura
    Oct.
    Released R&D type dry etching system RIE-400iPB for MEMS

  26. 2010

    Apr.
    Became listed in Osaka Securies Exchange JASDAQ Market (now TSE JASDAQ (standard) market) as a result of the merge of Osaka Securities of Exchange, Co., Ltd. and Jasdaq Securities Exchange, Inc.
    Jul.
    Released production type plasma CVD system PD-330STC for TSV
    Jul.
    Released production type plasma CVD system PD-5400 for LED
    Aug.
    Opened East Coast Office in North Carolina, U.S. (Relocated in New York in May 2014)
    Sep.
    Opened Beijing Office

  27. 2011

    Dec.
    Released production type ICP etching system RIE-331iPC for LED

  28. 2012

    Nov.
    Released ICP etching system RIE-600iP for SiC power device

  29. 2013

    Jul.
    Transferred Samco’s stock listing to Tokyo Stock Exchange Market Second Section
    Oct.
    Released production type ICP etching system RIE-600iPC for SiC power device
    Nov.
    Released production type RIE system RIE-800iPBC for MEMS

  30. 2014

    Jan.
    Transferred Samco’s stock listing to Tokyo Stock Exchange Market First Section
    Mar.
    Signed distribution agreement of MOCVD systems with Valence Process Equipment Inc. (U.S.)
    May
    Acquired UCP Processing (Lichtenstein) as a subsidiary (Later renamed as samco-ucp AG)

  31. 2015

    Sep.
    Increased capital to JPY 1.66 billion through public offering
    Dec.
    Signed distribution agreement of SiC epitaxial CVD system with Epiluvac AB (Sweden)
    Released ALD system AL-1 for electronic devices

  32. 2016

    Jun.
    Opened Production Center II in Kyoto
    Aug.
    Opened Malaysia Office
    Sep.
    Released Aqua Plasma™ cleaner AQ-2000

  33. 2019

    Sep.
    Held 40th anniversary event at Kyoto Hotel Okura

  34. 2020

    Jul.
    Opened PECVD and ALD demonstration facility in the Production Building II

  35. 2021

    Mar.
    Developed plasma techniques for inactivation of coronaviruses
    Dec.
    Released cluster tool system Cluster H™ for compound semiconductor device

  36. 2022

    Mar.
    Opened research center for nano thin films & materials
    Apr.
    Transferred Samco’s stock listing to Prime Market of the Tokyo Stock Exchange
    Oct.
    Released plasma enhanced ALD system AD-800LP

  37. 2023

    Oct.
    Released three-chamber plasma enhanced CVD system PD-2203LC
    Nov.
    Started research collaboration with Eastern Switzerland University of Applied Sciences (OST)
    Nov.
    Decided to construct third R&D facility for innovative semiconductor process equipment

  38. 2024

    May
    Started to construct third R&D facility, named Advanced Technology Development Center